solution description
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1). Project background:Requirement description:1. Originally, the method of surface array camera + two-dimensional moving robot arm was used for shooting, and the copper plate was stationary while the camera was moving; Visual inspection, can not sav...
1). Project background:Requirement description:First, the PCB board is photographed by the upper camera, and the coordinates of the solder joints that need to be measured are given for rough positioning. Then the two manipulators respectively carry a...
Explore HIFLY machine vision solutions for semiconductor and integrated circuit production, enabling high-precision inspection and automation.